SSI was pleased to welcome a representative from the Hong Kong University of Science and Technology (HKUST) today. During the visit, students learned about HKUST’s academic programs, international community, research opportunities, and the unique advantages of studying and working in Hong Kong.
Located at the center of major East Asian cities such as Seoul, Tokyo, Manila, Bangkok, and Hanoi, Hong Kong offers students access to one of the world’s leading financial and business hubs. As a multilingual city where Cantonese, Mandarin, and English are widely used, Hong Kong also provides a highly international environment for students from around the world.
HKUST itself reflects this global character, with students representing more than 80 nationalities. The university offers extensive exchange opportunities with institutions including UC Berkeley, NYU, Columbia University, the University of Pennsylvania, the University of Toronto, NUS, USC, and the London School of Economics, with no additional tuition required for participating students.
Students also learned about HKUST’s strong emphasis on experiential learning. Programs such as the Undergraduate Research Opportunities Program (UROP) allow undergraduates to participate directly in research, while students may pursue multiple internship opportunities throughout their studies. HKUST also hosts Career Mosaic each semester, bringing more than 230 companies to campus.
The presentation introduced students to programs such as the BSc in Global China Studies and BSc in Quantitative Social Analysis, which combine social science perspectives with global, analytical, and computational approaches.
The session concluded with information about post-graduation opportunities in Hong Kong, including its favorable policies for international graduates, as well as a new need-based scholarship opportunity for international students.
We thank HKUST for visiting SSI and providing participating students with valuable insight into studying, researching, and building a career in Hong Kong.
